The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jun. 14, 2012
Applicants:

Nobuhito Ito, Hiki-gun, JP;

Kazuyoshi Yoneda, Hiki-gun, JP;

Masao Arima, Hiki-gun, JP;

Inventors:

Nobuhito Ito, Hiki-gun, JP;

Kazuyoshi Yoneda, Hiki-gun, JP;

Masao Arima, Hiki-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); C08K 5/5313 (2006.01); C08K 5/5399 (2006.01); G03F 7/038 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); C08G 18/34 (2006.01); C08G 18/64 (2006.01); C08G 18/73 (2006.01); C08G 18/80 (2006.01); C09D 175/04 (2006.01); G03F 7/027 (2006.01); G03F 7/031 (2006.01); G03F 7/035 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/287 (2013.01); C08G 18/348 (2013.01); C08G 18/6407 (2013.01); C08G 18/73 (2013.01); C08G 18/80 (2013.01); C09D 175/04 (2013.01); G03F 7/027 (2013.01); G03F 7/031 (2013.01); G03F 7/035 (2013.01); H05K 2201/012 (2013.01);
Abstract

An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.


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