The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Mar. 30, 2009
Masataka Mizukoshi, Kawasaki, JP;
Yoshikatsu Ishizuki, Kawasaki, JP;
Kanae Nakagawa, Kawasaki, JP;
Keishiro Okamoto, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Taiji Sakai, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Yoshikatsu Ishizuki, Kawasaki, JP;
Kanae Nakagawa, Kawasaki, JP;
Keishiro Okamoto, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Taiji Sakai, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor substrate is secured by suction to a rear face of a supporting face of a substrate supporting table. In this event, the thickness of the semiconductor substrate is made fixed by planarization on the rear face, and the rear face is forcibly brought into a state free from undulation by the suction to the supporting face, so that the rear face becomes a reference face for planarization of a front face. In this state, a tool is used to cut surface layers of Au projections and a resist mask on the front face, thereby planarizing the Au projections and the resist mask so that their surfaces become continuously flat. This can planarize the surfaces of fine bumps formed on the substrate at a low cost and a high speed in place of CMP.