The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Sep. 26, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Russell Carlton McMullan, Allen, TX (US);

Dong Joo Bae, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/78 (2006.01); H01L 21/265 (2006.01); H01L 21/02 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823864 (2013.01); H01L 21/823814 (2013.01); H01L 29/7843 (2013.01); H01L 21/0217 (2013.01); H01L 21/324 (2013.01);
Abstract

A process of forming a CMOS integrated circuit by forming a first stressor layer over two MOS transistors of opposite polarity, removing a portion of the first stressor layer from the first transistor, and forming a second stressor layer over the two transistors. A source/drain anneal is performed, crystallizing amorphous regions of silicon in the gates of the two transistors, and subsequently removing the stressor layers. A process of forming a CMOS integrated circuit by forming two transistors of opposite polarity, forming a two stressor layers over the transistors, annealing the integrated circuit, removing the stressor layers, and siliciding the transistors. A process of forming a CMOS integrated circuit with an NMOS transistor and a PMOS transistor using a stress memorization technique, by removing the stressor layers with wet etch processes.


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