The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Nov. 23, 2011
Applicants:

Kirstin Petersen, Regensburg, DE;

Frank Baumann, Regensburg, DE;

Dominik Eisert, Regensburg, DE;

Hailing Cui, Regensburg, DE;

Inventors:

Kirstin Petersen, Regensburg, DE;

Frank Baumann, Regensburg, DE;

Dominik Eisert, Regensburg, DE;

Hailing Cui, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 33/504 (2013.01); H01L 33/505 (2013.01); H01L 2933/0041 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method is provided for producing a radiation-emitting semiconductor chip, in which a first wavelength-converting layer is applied over the radiation exit face of a semiconductor body. The application method is selected from the following group: sedimentation, electrophoresis. In addition, a second wavelength-converting layer is applied over the radiation exit face of the semiconductor body. The second wavelength-converting layer is either produced in a separate method step and then applied or the application method is sedimentation, electrophoresis or printing. Furthermore, a radiation-emitting semiconductor chip and a radiation-emitting component are provided.


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