The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jun. 28, 2013
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventor:

Dong-Seop Park, Yongin, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/56 (2006.01); H01L 21/56 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); H01L 21/56 (2013.01); H01L 51/525 (2013.01); H01L 2251/566 (2013.01);
Abstract

A method of manufacturing an organic light emitting diode (OLED) display according to an exemplary embodiment includes: forming a display unit displaying an image and a driver positioned near the display unit to drive a light emitting element of the display unit in a lower mother substrate; forming a sealant and a plurality of bumps in an upper mother substrate; aligning the lower mother substrate and the upper mother substrate to face each other; melting and hardening the sealant to combine the lower mother substrate and the upper mother substrate; cutting the upper mother substrate; and cutting the lower mother substrate, wherein the cutting of the upper mother substrate is performed according to a first cutting line between the sealant and the bumps and a second cutting line corresponding to the bumps.


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