The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Mar. 12, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Katsuyuki Hoshino, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/36 (2006.01); H01S 5/30 (2006.01); H01S 5/10 (2006.01); G02B 6/122 (2006.01); B82Y 20/00 (2011.01); H01S 5/183 (2006.01); H01S 5/343 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/36 (2013.01); H01S 5/30 (2013.01); H01S 5/105 (2013.01); G02B 6/1225 (2013.01); B82Y 20/00 (2013.01); H01S 5/183 (2013.01); H01S 5/34333 (2013.01); H01S 2304/00 (2013.01); H01L 21/02389 (2013.01); H01L 21/02458 (2013.01); H01L 21/0254 (2013.01); H01L 21/02603 (2013.01); H01L 21/0262 (2013.01); H01L 21/02639 (2013.01); H01L 21/02647 (2013.01);
Abstract

Provided is a method of manufacturing a photonic crystal, including: a first step of forming, on a surface of a substrate, a protective mask for selective growth, the protective mask having an opening pattern opened therein; a second step of selectively growing a columnar semiconductor from an exposed portion of the surface of the substrate not having the mask formed thereon, laterally overgrowing the semiconductor layer on the mask, and embedding the mask; a third step of forming a photonic crystal in the semiconductor layer so that openings in the opening pattern and the one of pores and grooves which form the photonic crystal are at least partly overlapped each other when seen from a direction perpendicular to the surface of the substrate; a fourth step of removing at least part of the columnar semiconductor; and a fifth step of removing at least part of the mask.


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