The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Aug. 10, 2007
Applicants:
David Starikov, Houston, TX (US);
Abdelhak Bensaoula, Houston, TX (US);
Inventors:
David Starikov, Houston, TX (US);
Abdelhak Bensaoula, Houston, TX (US);
Assignee:
Integrated Micro Sensors, Inc., Houston, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 26/06 (2014.01); B23K 26/36 (2014.01); C04B 37/02 (2006.01); C09J 5/02 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); B23K 1/20 (2013.01); B23K 26/0084 (2013.01); B23K 26/0604 (2013.01); B23K 26/0608 (2013.01); B23K 26/365 (2013.01); C04B 37/026 (2013.01); C09J 5/02 (2013.01); B23K 2203/04 (2013.01); B23K 2203/10 (2013.01); B23K 2203/18 (2013.01); C04B 2237/12 (2013.01); C04B 2237/123 (2013.01); C04B 2237/125 (2013.01); C04B 2237/127 (2013.01); C04B 2237/34 (2013.01); C04B 2237/341 (2013.01); C04B 2237/345 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/403 (2013.01); C04B 2237/64 (2013.01); C04B 2237/72 (2013.01); C09J 2400/166 (2013.01);
Abstract
Improved methods of bonding solid materials include a step of fabricating a micro-column array (MCA) on at least one surface to be bonded. The MCA formation process can be modified to cause and/or prevent chemical alteration of the surface being treated or to deposit a coating on the surface. In a preferred embodiment, the MCA is fabricated by laser treating the surface, such as by laser ablation.