The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Jan. 31, 2008
Applicants:

Syuji Ichimura, Bunkyo-ku, JP;

Masataka Sudo, Bunkyo-ku, JP;

Inventors:

Syuji Ichimura, Bunkyo-ku, JP;

Masataka Sudo, Bunkyo-ku, JP;

Assignee:

Nichiban Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); C09J 7/02 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0296 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); C09J 2201/162 (2013.01);
Abstract

An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mmor higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm.


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