The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Sep. 08, 2011
Applicants:

Messaoud Bedjaoui, Echirolles, FR;

Sylvain Poulet, Victor de Cessieu, FR;

Inventors:

Messaoud Bedjaoui, Echirolles, FR;

Sylvain Poulet, Victor de Cessieu, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); H01M 2/02 (2006.01); H01M 6/18 (2006.01); H01M 6/40 (2006.01); H01M 10/052 (2010.01); H01M 10/0562 (2010.01); H01M 10/0585 (2010.01); H01M 4/04 (2006.01); H01M 4/1391 (2010.01); H01M 4/1395 (2010.01); H01M 4/1397 (2010.01); H01M 4/485 (2010.01); H01M 4/58 (2010.01);
U.S. Cl.
CPC ...
H01M 10/0436 (2013.01); H01M 2/021 (2013.01); H01M 2/0275 (2013.01); H01M 2/0277 (2013.01); H01M 6/187 (2013.01); H01M 6/188 (2013.01); H01M 6/40 (2013.01); H01M 10/052 (2013.01); H01M 10/0562 (2013.01); H01M 10/0585 (2013.01); H01M 2/0287 (2013.01); H01M 2/0292 (2013.01); H01M 4/0426 (2013.01); H01M 4/0428 (2013.01); H01M 4/1391 (2013.01); H01M 4/1395 (2013.01); H01M 4/1397 (2013.01); H01M 4/485 (2013.01); H01M 4/5815 (2013.01); H01M 2300/0068 (2013.01); H01M 2300/0094 (2013.01); Y02E 60/122 (2013.01);
Abstract

The method for patterning a polymer layer arranged on a support comprises deposition of a layer made from a lithium-based polymerization inhibitor material on a first area of the support, deposition of a cationically polymerizable material on the polymerization inhibitor layer and on a second area of the support, application of polymerization treatment resulting in a non-solidified sacrificial layer in the first area and the polymer layer in the second area, and elimination of the sacrificial layer.


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