The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Dec. 16, 2008
Applicants:

Hartmut Rudmann, Jona, CH;

Susanne Westenhofer, Wettswil, CH;

Stephan Heimgartner, Lucerne, CH;

Diane Morgan, Zurich, CH;

Markus Rossi, Jona, CH;

Inventors:

Hartmut Rudmann, Jona, CH;

Susanne Westenhofer, Wettswil, CH;

Stephan Heimgartner, Lucerne, CH;

Diane Morgan, Zurich, CH;

Markus Rossi, Jona, CH;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 5/00 (2006.01); B29D 11/00 (2006.01); B28B 3/00 (2006.01); B29C 43/02 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00365 (2013.01); B29C 43/021 (2013.01); B29L 2011/0016 (2013.01);
Abstract

A method includes the steps of: providing a substrate; providing a tool having, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of an optical element(s), the tool further including at least one contact spacer portion, the contact spacer portion protruding, on the replication side, further than an outermost feature of the replication sections; aligning the tool with a feature of the substrate and bringing the tool and a first side of the substrate together, with replication material between the tool and the substrate, the contact spacer portion contacting the first side of the substrate, and thereby causing the spacer portion to adhere to the first side of the substrate, thereby producing a substrate-tool-assembly; dislocating the substrate-tool-assembly to a hardening station; causing the replication material to harden at the hardening station; and separating the tool from the substrate with the hardened replication material adhering to the substrate.


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