The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Nov. 23, 2011
Applicants:
Masayuki Yamamoto, Ibaraki, JP;
Yukitoshi Hase, Kameyama, JP;
Inventors:
Masayuki Yamamoto, Ibaraki, JP;
Yukitoshi Hase, Kameyama, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F24H 3/00 (2006.01); H01L 21/677 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6776 (2013.01); H01L 21/67109 (2013.01); H01L 21/67132 (2013.01); H01L 21/67784 (2013.01);
Abstract
A semiconductor wafer joined to a carrier via a double-faced adhesive tape having an adhesive layer of a heating separation property is heated for removal from the carrier. The double-faced adhesive tape is separated from the semiconductor wafer on a holding table. Thereafter, an air nozzle preliminarily cools the semiconductor wafer for a given time during transportation with a wafer transport section. Upon completion of the preliminary cooling, the semiconductor wafer is placed on a cooling stage to cool it to a target temperature.