The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Jul. 01, 2013
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Hiromi Ichijo, Chiryu, JP;

Shoji Sakai, Toyota, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 1/00 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01); H01L 25/11 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02M 1/00 (2013.01); H01L 23/473 (2013.01); H01L 23/4006 (2013.01); H01L 25/117 (2013.01); H02M 7/003 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.


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