The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Nov. 04, 2013
Ngk Insulators, Ltd., Nagoya, JP;
Takami Hirai, Toyota, JP;
Shinsuke Yano, Nagoya, JP;
Tsutomu Nanataki, Toyoake, JP;
Hirofumi Yamaguchi, Komaki, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such as a power semiconductor element, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, in high-capacity modules including power modules, such as an inverter. [Solution Means] In a high-capacity module, by laminating a peripheral circuit using a ceramic circuit board with electrode(s) constituted by thick conductor and embedded therein on a highly exothermic element, overheating of the module is prevented by effective heat dissipation via the circuit board while attaining reduction in size and weight, reduction in surge, and reduction in a loss in the module.