The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Mar. 23, 2012
Applicants:

Shogo Mori, Kariya, JP;

Shinobu Tamura, Oyama, JP;

Shinobu Yamauchi, Oyama, JP;

Taizo Kuribayashi, Oyama, JP;

Inventors:

Shogo Mori, Kariya, JP;

Shinobu Tamura, Oyama, JP;

Shinobu Yamauchi, Oyama, JP;

Taizo Kuribayashi, Oyama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H05K 7/20518 (2013.01); H05K 7/2039 (2013.01); H05K 7/20263 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01);
Abstract

A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.


Find Patent Forward Citations

Loading…