The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

May. 07, 2012
Applicants:

Yoshitaka Yamaguchi, Kawasaki, JP;

Taisuke Iwai, Kawasaki, JP;

Shinichi Hirose, Kawasaki, JP;

Daiyu Kondo, Kawasaki, JP;

Ikuo Soga, Kawasaki, JP;

Yohei Yagishita, Kawasaki, JP;

Yukie Sakita, Kawasaki, JP;

Inventors:

Yoshitaka Yamaguchi, Kawasaki, JP;

Taisuke Iwai, Kawasaki, JP;

Shinichi Hirose, Kawasaki, JP;

Daiyu Kondo, Kawasaki, JP;

Ikuo Soga, Kawasaki, JP;

Yohei Yagishita, Kawasaki, JP;

Yukie Sakita, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/433 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/433 (2013.01); H01L 23/373 (2013.01); H01L 24/28 (2013.01); H01L 24/31 (2013.01); H01L 23/3733 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/014 (2013.01); Y10S 977/742 (2013.01); Y10S 977/734 (2013.01); Y10S 977/739 (2013.01);
Abstract

The electronic device includes a heat generator, a heat radiator, and a heat radiation materialdisposed between the heat generatorand the heat radiatorand including a plurality of linear structuresof carbon atoms and a filling layerformed of a thermoplastic resin and disposed between the plurality of linear structures


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