The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
May. 30, 2012
Vadim Boguslavskiy, Princeton, NJ (US);
Joshua Mangum, Sarasota, FL (US);
Matthew King, Montville, NJ (US);
Earl Marcelo, South Plainfield, NJ (US);
Eric A. Armour, Pennington, NJ (US);
Alexander I. Gurary, Bridgewater, NJ (US);
William E. Quinn, Whitehouse Station, NJ (US);
Guray Tas, Flanders, NJ (US);
Vadim Boguslavskiy, Princeton, NJ (US);
Joshua Mangum, Sarasota, FL (US);
Matthew King, Montville, NJ (US);
Earl Marcelo, South Plainfield, NJ (US);
Eric A. Armour, Pennington, NJ (US);
Alexander I. Gurary, Bridgewater, NJ (US);
William E. Quinn, Whitehouse Station, NJ (US);
Guray Tas, Flanders, NJ (US);
Veeco Instruments Inc., Plainview, NY (US);
Abstract
A method for characterizing a surface comprises rotating a carrier about an axis of rotation where the carrier has a top surface adapted to hold at least one semiconductor wafer with a major surface of the wafer extending generally transverse to the axis of rotation. A surface characterization tool is moved over a plurality of positions relative to the top surface of the carrier, where a measurement location over the top surface of the carrier is changed while said top surface of the carrier is heated to a predetermined temperature. Characterization signals over the plurality of positions with the surface characterization tool are produced and contain information about the heated top surface of the carrier, or when semiconductor wafers are held on the carrier, information about the semiconductor wafer can also be obtained.