The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Mar. 14, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Sang-Sick Park, Seoul, KR;

Myung-Sung Kang, Hwaseong-si, KR;

Ji-Seok Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 5/232 (2006.01); G03B 13/00 (2006.01); H04N 9/04 (2006.01); H01J 7/24 (2006.01); H01J 40/14 (2006.01); H01L 31/0232 (2014.01); H01L 31/0203 (2014.01); H01L 21/00 (2006.01); H01L 31/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2251 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 5/2257 (2013.01);
Abstract

Bi-directional camera modules and flip chip bonders including the same are provided. The module includes a circuit board on which an upper sensor and a lower sensor are mounted, an upper lens and a lower lens disposed on the upper sensor and under the lower sensor, respectively, and a housing fixing the upper lens and the lower lens spaced apart from the upper sensor and the lower sensor, respectively. The housing surrounds the circuit board. The housing has a plurality of inlets and an outlet through which air flows, and the housing has an air passage connected from the inlets to the outlet via a space between lower lens and the lower sensor.


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