The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Jun. 25, 2012
Applicants:

J. Gary Eden, Champaign, IL (US);

Sung-jin Park, Champaign, IL (US);

Jin Hoon Cho, Champaign, IL (US);

Jeffrey H. MA, Darien, IL (US);

Inventors:

J. Gary Eden, Champaign, IL (US);

Sung-Jin Park, Champaign, IL (US);

Jin Hoon Cho, Champaign, IL (US);

Jeffrey H. Ma, Darien, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/30 (2006.01); H01J 37/32 (2006.01); H05H 1/24 (2006.01); H01J 9/18 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32467 (2013.01); H05H 1/2406 (2013.01); H05H 2001/2418 (2013.01); H05H 2001/2462 (2013.01); H01J 9/18 (2013.01); H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32568 (2013.01);
Abstract

Preferred embodiments of the present invention include microplasma jet devices and arrays in various materials, and low temperature microplasma jet devices and arrays. These include preferred embodiment single microplasma jet devices and arrays of devices formed in monolithic polymer blocks with elongated microcavities. The arrays can be densely packed, for example having 100 jets in an area of a few square centimeters. Additional embodiments include metal/metal oxide microplasma jet devices that have micronozzles defined in the metal oxide itself. Methods of fabrication of microplasma jet devices are also provided by the invention, and the methods have been demonstrated as being capable of producing tailored micronozzle contours that are unitary with the material insulating electrodes.


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