The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Jun. 23, 2010
Applicants:

Masashi Yamasaki, Obu, JP;

Hideki Kabune, Nagoya, JP;

Atsushi Furumoto, Nukata-gun, JP;

Inventors:

Masashi Yamasaki, Obu, JP;

Hideki Kabune, Nagoya, JP;

Atsushi Furumoto, Nukata-gun, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 11/00 (2006.01); B62D 5/04 (2006.01); H02K 5/22 (2006.01); H02K 9/22 (2006.01); H02K 3/50 (2006.01);
U.S. Cl.
CPC ...
H02K 11/0073 (2013.01); B62D 5/0406 (2013.01); H02K 5/225 (2013.01); H02K 9/22 (2013.01); H02K 3/50 (2013.01);
Abstract

An electronic control unit () including semiconductor modules (to) and capacitors (to) is disposed in the axial direction of a motor (). The semiconductor modules (to) are placed longitudinally and brought into contact with a heat sink (). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (to) is perpendicular to the axial line of the motor (). Accordingly, the capacitors (to) are disposed so that at least a part of the capacitors (to) overlap the semiconductor modules (to) and heat sink () in the axial direction of the motor ().


Find Patent Forward Citations

Loading…