The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Aug. 07, 2013
Applicant:

Soongsil University Research Consortium Techno-park, Seoul, KR;

Inventors:

Chang Kun Park, Suwon-si, KR;

Ho Yong Hwang, Gyeongsangnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/30107 (2013.01);
Abstract

Provided is a power voltage supply apparatus of a 3-dimensional (3D) semiconductor. The power voltage supply apparatus includes a plurality of integrated circuits (ICs) which each include a first through silicon via (TSV) and a second TSV, are stacked such that the first TSVs are connected and second TSVs are connected, and are mounted on a printed circuit board (PCB), wherein a first PCB line formed on the PCB and supplying a first voltage is connected to a bottom of a first TSV of a bottom IC from among the plurality of ICs, and a second PCB line formed on the PCB and supplying a second voltage is connected to a top of a second TSV of a top IC.


Find Patent Forward Citations

Loading…