The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Mar. 01, 2013
Applicant:
AU Optronics Corporation, Hsinchu, TW;
Inventors:
Cheng-Liang Wang, Hsinchu County, TW;
Shih-Hsing Hung, Hsinchu County, TW;
Keh-Long Hwu, Hsinchu County, TW;
Assignee:
Au Optronics Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/02107 (2013.01); H01L 21/48 (2013.01);
Abstract
A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer.