The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Nov. 14, 2013
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Hirokazu Matsuda, Osaka, JP;

Haruka Ona, Osaka, JP;

Yasunari Ooyabu, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); C08L 83/06 (2006.01); C09D 183/14 (2006.01); H01L 33/62 (2010.01); C08G 77/12 (2006.01); C08G 77/16 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); C08L 83/06 (2013.01); H01L 33/62 (2013.01); C09D 183/14 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08G 77/20 (2013.01);
Abstract

An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 μm or more.


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