The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Aug. 29, 2011
Applicants:

Michael Peil, Otzberg, DE;

Florin Oswald, Frankfurt am Main, DE;

Harald Maiweg, Korschenbroich, DE;

Inventors:

Michael Peil, Otzberg, DE;

Florin Oswald, Frankfurt am Main, DE;

Harald Maiweg, Korschenbroich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/54 (2010.01); F21K 99/00 (2010.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01); H01L 31/0203 (2014.01); F21Y 101/02 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); F21K 9/00 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H05K 3/284 (2013.01); H01L 31/0203 (2013.01); F21K 9/90 (2013.01); F21Y 2101/02 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.


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