The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Dec. 23, 2009
Hyun A. Chun, Gyeonggi-do, KR;
Jae Bong Choi, Gyeonggi-do, KR;
Sung Won Lee, Seoul, KR;
Sung Wuk Ryu, Seoul, KR;
Hyuk Soo Lee, Gyeonggi-do, KR;
Sai Ran Eom, Incheon, KR;
Hyun A. Chun, Gyeonggi-do, KR;
Jae Bong Choi, Gyeonggi-do, KR;
Sung Won Lee, Seoul, KR;
Sung Wuk Ryu, Seoul, KR;
Hyuk Soo Lee, Gyeonggi-do, KR;
Sai Ran Eom, Incheon, KR;
LG Innotek Co., Ltd., Seoul, KR;
Abstract
The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.