The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Jun. 28, 2012
Applicant:
Kazuaki Sorimachi, Saitama, JP;
Inventor:
Kazuaki Sorimachi, Saitama, JP;
Assignees:
Citizen Holdings Co., Ltd., Tokyo, JP;
Citizen Electrinocs Co., Ltd., Yamanashi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/00 (2006.01); H01L 33/52 (2010.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/505 (2013.01); H01L 22/30 (2013.01); H01L 25/0753 (2013.01); H01L 2933/0041 (2013.01);
Abstract
The invention is directed to the provision of a method for manufacturing a semiconductor light-emitting element that eliminates the need for preparing a plurality of different fluorescent sheets. The method for manufacturing the semiconductor light-emitting element containing an LED die includes the steps of arranging the LED die on a fluorescent sheet containing a fluorescent substance and adjusting the amount by which the LED die is depressed into the fluorescent sheet so that the semiconductor light-emitting element has a desired color emission.