The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
May. 22, 2009
Hiroshi Uchida, Oita, JP;
Tomokazu Umezawa, Chiba, JP;
Masato Fukushima, Chiba, JP;
Shunsuke Takeyama, Yokohama, JP;
Takanori Sakuragi, Hiratsuka, JP;
Hiroshi Uchida, Oita, JP;
Tomokazu Umezawa, Chiba, JP;
Masato Fukushima, Chiba, JP;
Shunsuke Takeyama, Yokohama, JP;
Takanori Sakuragi, Hiratsuka, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A laminated body which forms a resin mold by compression molding using a master mold, the laminated body having: a pair of mutually facing base materials, a layer of a liquid or gel-like curable resin material sandwiched between the pair of base materials, and one or more flow suppression bodies, which are composed of a cured product of the curable resin material and are sandwiched between the pair of base materials, wherein the layer of the curable resin material is sealed by the pair of base materials and the flow suppression bodies. Also, a method for manufacturing a resin mold using the laminated body.