The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Mar. 19, 2012
Yasuaki Ootera, Yokohama, JP;
Yoshiyuki Kamata, Tokyo, JP;
Naoko Kihara, Kawasaki, JP;
Yoshiaki Kawamonzen, Machida, JP;
Takeshi Okino, Yokohama, JP;
Ryosuke Yamamoto, Kawasaki, JP;
Tomoyuki Maeda, Kawasaki, JP;
Norikatsu Sasao, Tokyo, JP;
Akiko Yuzawa, Kawasaki, JP;
Takuya Shimada, Yokokohama, JP;
Hiroyuki Hieda, Yokohama, JP;
Yasuaki Ootera, Yokohama, JP;
Yoshiyuki Kamata, Tokyo, JP;
Naoko Kihara, Kawasaki, JP;
Yoshiaki Kawamonzen, Machida, JP;
Takeshi Okino, Yokohama, JP;
Ryosuke Yamamoto, Kawasaki, JP;
Tomoyuki Maeda, Kawasaki, JP;
Norikatsu Sasao, Tokyo, JP;
Akiko Yuzawa, Kawasaki, JP;
Takuya Shimada, Yokokohama, JP;
Hiroyuki Hieda, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
In one embodiment, a method of manufacturing a mold includes: forming a first layer having an affinity to a second polymer on a substrate having an affinity to a first polymer; forming first and second openings in the first layer; filling a resist in the second openings and hardening the resist to obtain a hardened resist; and forming a second layer containing a block copolymer and causing it to self-assemble.