The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Nov. 26, 2012
William Peter Addiego, Big Flats, NY (US);
Michael John Bennett, Corning, NY (US);
Michael Patrick Carson, Corning, NY (US);
Jeffrey Scott Davis, Corning, NY (US);
Martin Herbert Goller, Campbell, NY (US);
Benjamin Zain Hanson, Big Flats, NY (US);
Tracey Lynn Timmons, Big Flats, NY (US);
William Peter Addiego, Big Flats, NY (US);
Michael John Bennett, Corning, NY (US);
Michael Patrick Carson, Corning, NY (US);
Jeffrey Scott Davis, Corning, NY (US);
Martin Herbert Goller, Campbell, NY (US);
Benjamin Zain Hanson, Big Flats, NY (US);
Tracey Lynn Timmons, Big Flats, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (R) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein.