The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Nov. 30, 2012
Hgst Netherlands B.v., Amsterdam, NL;
David P. Druist, Santa Clara, CA (US);
Glenn P. Gee, San Jose, CA (US);
Unal M. Guruz, San Jose, CA (US);
Edward H. Lee, San Jose, CA (US);
David J. Seagle, Morgan Hill, CA (US);
Darrick T. Smith, San Jose, CA (US);
HGST Netherlands B.V., Amsterdam, NL;
Abstract
Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 μm, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.