The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Aug. 19, 2009
Eiji Tsuru, Tokyo, JP;
Yasushi Hasegawa, Tokyo, JP;
Yasuhiro Shinohara, Tokyo, JP;
Yuichi Sato, Tokyo, JP;
Eiji Tsuru, Tokyo, JP;
Yasushi Hasegawa, Tokyo, JP;
Yasuhiro Shinohara, Tokyo, JP;
Yuichi Sato, Tokyo, JP;
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
Abstract
A liquid phase diffusion bonded pipe joint comprised of metal pipes or a metal pipe and a joint pipe joined by liquid phase diffusion bonding, the liquid phase diffusion bonded pipe joint comprised of a metal joint provided with a tapered slanted part press-fit into an end of a metal pipe by a thrust in a pipe axial direction while expanding the metal pipe in inside diameter and tightly engaging with the end and a joining surface part continuing from the tapered slanted part and joined with an end face of the metal pipe by liquid phase diffusion bonding and a metal pipe tightly engaging with the tapered slanted part in the expanded state and with an end face joined with the joining surface part by liquid phase diffusion bonding.