The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2015

Filed:

Oct. 24, 2013
Applicant:

David Finn, Tourmakeady, IE;

Inventor:

David Finn, Tourmakeady, IE;

Assignee:

Féinics AmaTech Tearanta, Lower Churchfield, Teurma Ready, Co. Mayo, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/00 (2006.01); B42D 15/00 (2006.01); B32B 37/12 (2006.01); G06K 19/02 (2006.01); G06K 19/067 (2006.01); G06K 19/073 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 7/00 (2006.01); B32B 38/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B42D 15/00 (2013.01); B32B 37/1207 (2013.01); G06K 19/025 (2013.01); G06K 19/0672 (2013.01); G06K 19/07318 (2013.01); G06K 19/07327 (2013.01); G06K 19/07722 (2013.01); G06K 19/07745 (2013.01); G06K 19/07749 (2013.01); G06K 19/0775 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 7/00 (2013.01); B32B 38/10 (2013.01); H01L 24/85 (2013.01); B32B 2037/1269 (2013.01); B32B 2305/342 (2013.01); B32B 2425/00 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3025 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45144 (2013.01);
Abstract

Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.


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