The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Jul. 18, 2011
Applicants:

Yasuo Kanda, Kanagawa, JP;

Koichi Amari, Kanagawa, JP;

Shunsaku Tokito, Kanagawa, JP;

Yuji Torige, Kanagawa, JP;

Takayuki Arima, Nagasaki, JP;

Takafumi Kunihiro, Kanagawa, JP;

Inventors:

Yasuo Kanda, Kanagawa, JP;

Koichi Amari, Kanagawa, JP;

Shunsaku Tokito, Kanagawa, JP;

Yuji Torige, Kanagawa, JP;

Takayuki Arima, Nagasaki, JP;

Takafumi Kunihiro, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 17/18 (2006.01); G11C 17/00 (2006.01); H01L 23/525 (2006.01); G11C 17/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); G11C 17/16 (2013.01);
Abstract

A semiconductor device has an electrical fuse element including: a first filament; a second filament connected to the first filament; and a series readout section connected to an end of the first filament opposite to another end of the first filament connected to the second filament, the series readout section reading series resistance of the first filament and the second filament.


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