The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Oct. 12, 2011
Applicants:
Akihiko Akasegawa, Kawasaki, JP;
Satoshi Masuda, Kawasaki, JP;
Inventors:
Akihiko Akasegawa, Kawasaki, JP;
Satoshi Masuda, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01S 13/00 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 2924/30107 (2013.01); H01L 2224/48175 (2013.01); H01L 23/66 (2013.01); H01L 2924/15192 (2013.01); H01L 2223/6683 (2013.01); H01L 24/48 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/16172 (2013.01); H01L 23/3677 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/16196 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/15174 (2013.01);
Abstract
An electronic apparatus includes a metal base; a wiring board disposed on the metal base, the wiring board having an opening and including interconnects; a metal stage dispose in the opening, the metal stage serving as a ground line; and a semiconductor device disposed on the metal stage, wherein an area of an end surface of the metal stage facing the metal base is larger than that of the metal stage facing the semiconductor device.