The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Sep. 13, 2012
Applicants:
Doojin Kim, Chungcheongnam-do, KR;
Youngsik Kim, Chungcheongnam-do, KR;
Kitaik OH, Chungcheongnam-do, KR;
Sungbok Hong, Chungcheongnam-do, KR;
Inventors:
Doojin Kim, Chungcheongnam-do, KR;
Youngsik Kim, Chungcheongnam-do, KR;
Kitaik Oh, Chungcheongnam-do, KR;
Sungbok Hong, Chungcheongnam-do, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.