The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Mar. 18, 2013
Packaging method using solder coating ball and package having solder pattern including metal pattern
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Jin Won Choi, Suwon, KR;
Yon Ho You, Suwon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 24/81 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01);
Abstract
A packaging method comprises steps of forming a plurality of pads and another circuit pattern on a substrate, forming a second dry film pattern including opening exposing the pad, mounting a solder coating ball in the opening of the second dry film pattern, performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern, delaminating the second dry film pattern, and forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern.