The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Apr. 28, 2006
Applicant:
David J. Lima, Los Altos, CA (US);
Inventor:
David J. Lima, Los Altos, CA (US);
Assignee:
Juniper Networks, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H01L 23/373 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 21/4882 (2013.01); H01L 23/3737 (2013.01); H01L 23/40 (2013.01); H01L 24/28 (2013.01); H01L 24/83 (2013.01); H01L 2224/838 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01);
Abstract
A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the removable adhesive layer. Use of an interposer layer and a removable adhesive layer in combination with a non-removable adhesive layer, provides a high performance heat dissipation assembly while enabling re-working of the assembly following initial manufacture.