The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Jul. 20, 2012
Applicants:

Mahiro Tsujino, Kyoto, JP;

Manabu Miyahara, Kyoto, JP;

Inventors:

Mahiro Tsujino, Kyoto, JP;

Manabu Miyahara, Kyoto, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/057 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/42 (2013.01); H01L 23/057 (2013.01); H01L 23/10 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/171 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01);
Abstract

A semiconductor device housing package includes a base body having, on its upper surface, a mounting region of a semiconductor device; a frame body having a frame-like portion disposed on the upper surface of the base body, surrounding the mounting region, and an opening penetrating through from an inner side of the frame-like portion to an outer side thereof; a flat plate-like insulating member disposed in the opening, extending from an interior of the frame body to an exterior thereof; wiring conductors disposed on an upper surface of the insulating member, extending from the interior of the frame body to the exterior thereof; and a metallic film disposed on a part of the upper surface of the insulating member, the metallic film lying outside the frame body surrounding the wiring conductors.


Find Patent Forward Citations

Loading…