The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Feb. 21, 2013
Applicant:

Stanley Electric Co., Ltd., Tokyo, JP;

Inventors:

Tatsuma Saito, Tokyo, JP;

Mamoru Miyachi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); F21S 8/10 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 27/153 (2013.01); H01L 33/0079 (2013.01); H01L 33/20 (2013.01); H01L 33/385 (2013.01); H01L 33/38 (2013.01); H01L 2924/0002 (2013.01); F21S 48/1154 (2013.01); F21S 48/1159 (2013.01);
Abstract

There is provided a highly reliable semiconductor light emitting element and vehicle lighting unit as well as associated methods. The semiconductor light emitting element can include a support substrate, a semiconductor stacked body including a first semiconductor layer of a first conductivity type, an active layer formed on the first semiconductor layer, and a second semiconductor layer of a second conductivity type formed on the active layer. The element can further include a bonding layer configured to bond the support substrate and the semiconductor stacked body, the bonding layer having a side surface that forms an angle exceeding 90° with a surface of the bonding layer on the side of the semiconductor stacked body, and an interconnection layer configured to extend from the upper surface of the semiconductor stacked body to cover the side surface of the bonding layer.


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