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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8952396 B1

PDFFull Text
Expired
Date of Patent:
Feb. 10, 2015

Filed:

May. 18, 2012

Led module, backlight unit including the led module, and method for manufacturing the led module

Applicants:

Jee Hoon Sung, Seongnam-si, KR;

Jin Hyun Cho, Seoul, KR;

Jung Kyun Kim, Seongnam-si, KR;

Inventors:

Jee Hoon Sung, Seongnam-si, KR;

Jin Hyun Cho, Seoul, KR;

Jung Kyun Kim, Seongnam-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Stephen F Husar

Assistant Examiner:

James Cranson, Jr

Int. Cl.
CPC ...
G09F 13/18 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H05K 1/0204 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H05K 1/056 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A light emitting diode (LED) module having a structure capable of effectively dissipating heat generated from an LED chip thereof, and a backlight unit including the same are disclosed. The LED module includes a base made of a metal material, an insulating layer provided on the base, a circuit layer provided on the insulating layer, an LED package provided on the circuit layer, and a bonding layer extending through the insulating layer and the circuit layer, to connect the LED package to the base.

Find Patent Forward Citations

Sung, Jee. (2015). Led module, backlight unit including the led module, and method for manufacturing the led module (U.S. Patent No. 8952396). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8952396

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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