The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Dec. 17, 2010
Applicants:

Mitsuhiko Ueda, Osaka, JP;

Takami Okubayashi, Mie, JP;

Takanori Sugiyama, Mie, JP;

Yoshiharu Sanagawa, Osaka, JP;

Takanori Aketa, Osaka, JP;

Yushi Nakamura, Mie, JP;

Masao Kirihara, Osaka, JP;

Inventors:

Mitsuhiko Ueda, Osaka, JP;

Takami Okubayashi, Mie, JP;

Takanori Sugiyama, Mie, JP;

Yoshiharu Sanagawa, Osaka, JP;

Takanori Aketa, Osaka, JP;

Yushi Nakamura, Mie, JP;

Masao Kirihara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/20 (2006.01); G01J 5/16 (2006.01); G01J 5/02 (2006.01); G01J 5/04 (2006.01); G01J 5/08 (2006.01);
U.S. Cl.
CPC ...
G01J 5/16 (2013.01); G01J 5/02 (2013.01); G01J 5/0205 (2013.01); G01J 5/0215 (2013.01); G01J 5/04 (2013.01); G01J 5/046 (2013.01); G01J 5/08 (2013.01); G01J 5/0806 (2013.01); G01J 5/0875 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/3025 (2013.01);
Abstract

An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.


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