The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

May. 09, 2011
Applicants:

Katsuya Sennyu, Tokyo, JP;

Hiroshi Hara, Tokyo, JP;

Takehisa Okuda, Tokyo, JP;

Inventors:

Katsuya Sennyu, Tokyo, JP;

Hiroshi Hara, Tokyo, JP;

Takehisa Okuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H05H 7/20 (2006.01); B23K 26/12 (2014.01); B23K 33/00 (2006.01); B23K 15/04 (2006.01); B23K 26/20 (2014.01); B23K 26/28 (2014.01);
U.S. Cl.
CPC ...
H05H 7/20 (2013.01); B23K 15/04 (2013.01); B23K 26/206 (2013.01); B23K 26/28 (2013.01); B23K 33/00 (2013.01); B23K 26/122 (2013.01); B23K 2201/04 (2013.01);
Abstract

Provided is a method of manufacturing a superconducting accelerator cavity in which a plurality of half cells having opening portions (equator portions and iris portions) at both ends thereof in an axial direction are placed one after another in the axial direction, contact portions where the corresponding opening portions come into contact with each other are joined by welding, and thus, a superconducting accelerator cavity is manufactured, the half cells to be joined are arranged so that the axial direction thereof extends in a vertical direction; and concave portions that are concave towards an outer side are also formed at inner circumferential surfaces located below the contact portions of the half cells positioned at a bottom; and the contact portions are joined from outside by penetration welding.


Find Patent Forward Citations

Loading…