The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Sep. 11, 2013
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/30 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/78 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49171 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 2224/45144 (2013.01);
Abstract
A semiconductor device according to an embodiment includes: a first unit device configured to include a semiconductor chip, a backside electrode that is in contact with a backside of the semiconductor chip, and a bonding wire in which one end is connected to the backside electrode; a second unit device configured to have a function different from that of the first unit device; a resin layer configured to fix the first and second unit devices to each other; and a first wiring that is formed on the resin layer on a surface side of the semiconductor chip and connected to the other end of the bonding wire.