The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Feb. 25, 2010
Applicants:

Eric Ladizinsky, Manhattan Beach, CA (US);

Geordie Rose, Burnaby, CA;

Jeremy P. Hilton, Burnaby, CA;

Eugene Dantsker, San Diego, CA (US);

Byong Hyop OH, San Jose, CA (US);

Inventors:

Eric Ladizinsky, Manhattan Beach, CA (US);

Geordie Rose, Burnaby, CA;

Jeremy P. Hilton, Burnaby, CA;

Eugene Dantsker, San Diego, CA (US);

Byong Hyop Oh, San Jose, CA (US);

Assignee:

D-Wave Systems Inc., Burnaby, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); H01L 27/18 (2006.01); B82Y 10/00 (2011.01); G06N 99/00 (2010.01); H01L 39/22 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
H01L 27/18 (2013.01); B82Y 10/00 (2013.01); G06N 99/002 (2013.01); H01L 39/223 (2013.01); H01L 39/2493 (2013.01);
Abstract

Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap contact connector.


Find Patent Forward Citations

Loading…