The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Jun. 10, 2011
Applicant:

Shingo Yamada, Yamanashi, JP;

Inventor:

Shingo Yamada, Yamanashi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H05K 13/04 (2006.01); B29C 63/02 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H01R 4/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/04 (2013.01); B29C 63/02 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/743 (2013.01); H05K 3/323 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/293 (2013.01); H01L 2224/743 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83851 (2013.01); H01L 2924/01004 (2013.01); H01R 4/04 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10446 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01033 (2013.01); H01L 24/83 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/07811 (2013.01);
Abstract

In the tape attaching method of cutting a tape member into conductive tape pieces and attaching the conductive tape pieces onto a plurality of attachment regions which are formed at a side edge part of a board, an attaching step in which the conductive tape pieces is attached onto the attachment region of a first press position, and a moving step, in which by driving a tape sending mechanism to perform the operation of sending the tape member while a press bonding head and a peeling unit are integrally moved relative to the board, the press bonding head is aligned with the attachment region of a second press position, and a separator is peeled from the tape member attached onto the first press position by the peeling unit during the relative movement, are repeated.


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