The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Sep. 21, 2011
Applicants:

David E. Havens, Bellbrook, OH (US);

Matthew C. Everhart, Fairborn, OH (US);

Randy Rex Kysar, Derby, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Delbert Leon Strelow, Wichita, KS (US);

Kevin John Ford, Winterville, NC (US);

Kristin Dru Pickell, Sandy, UT (US);

Inventors:

David E. Havens, Bellbrook, OH (US);

Matthew C. Everhart, Fairborn, OH (US);

Randy Rex Kysar, Derby, KS (US);

Carl Ray Fiegenbaum, Rose Hill, KS (US);

Jeffrey W. Priest, Rose Hill, KS (US);

Delbert Leon Strelow, Wichita, KS (US);

Kevin John Ford, Winterville, NC (US);

Kristin Dru Pickell, Sandy, UT (US);

Assignee:

Spirit AeroSystems, Inc., Wichita, KS (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B64C 1/06 (2006.01); B29C 33/00 (2006.01); B29C 70/44 (2006.01); B29C 33/38 (2006.01); B29C 33/40 (2006.01); B29C 33/48 (2006.01); B29C 53/58 (2006.01); B29C 53/82 (2006.01); B29C 70/30 (2006.01);
U.S. Cl.
CPC ...
B64C 1/06 (2013.01); B29C 33/00 (2013.01); B29C 70/446 (2013.01); B29C 33/3857 (2013.01); B29C 33/40 (2013.01); B29C 33/485 (2013.01); B29C 53/587 (2013.01); B29C 53/824 (2013.01); B29C 70/30 (2013.01); Y02T 50/433 (2013.01); Y02T 50/43 (2013.01);
Abstract

A method and apparatus for fabricating a composite part, such as a fuselage or internal stiffener, with a shape memory polymer (SMP) apparatus usable as both a rigid lay-up tool and a bladder. The SMP apparatus may be heated until malleable, shaped, and then cooled in a desired rigid tool configuration. For example, cavities may be formed into the SMP apparatus for nesting components therein to co-bond or co-cure with the composite part. Next, composite material may be applied onto the SMP apparatus and then placed into a rigid external tool and heated to composite cure temperatures at which the SMP apparatus is malleable. A pressure differential may be induced which urges the SMP apparatus to compress the composite material against the rigid external tool. When the composite material is cured, the SMP apparatus may be urged away from the cured composite material and removed from within the composite part.


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