The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Sep. 03, 2010
Applicants:

Michael Schäfer, Künzell, DE;

Wolfgang Schmitt, Rodgau, DE;

Jian Zeng, Lippstadt, DE;

Inventors:

Michael Schäfer, Künzell, DE;

Wolfgang Schmitt, Rodgau, DE;

Jian Zeng, Lippstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/22 (2006.01); B23K 35/26 (2006.01); B23K 35/34 (2006.01); B22F 1/00 (2006.01); B22F 3/10 (2006.01); B22F 7/04 (2006.01); B23K 35/02 (2006.01); B23K 35/36 (2006.01); B23K 35/365 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/34 (2013.01); B22F 1/0062 (2013.01); B22F 3/1003 (2013.01); B22F 7/04 (2013.01); B23K 35/025 (2013.01); B23K 35/3602 (2013.01); B23K 35/3618 (2013.01); B23K 35/365 (2013.01); H01L 24/83 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01038 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/10253 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01);
Abstract

A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.


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