The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Oct. 23, 2013
Applicant:
Ihi Corporation, Tokyo, JP;
Inventors:
Naoki Oiwa, Tokyo, JP;
Rie Sakamoto, Tokyo, JP;
Yasuhiro Otake, Tokyo, JP;
Mitsuyoshi Tsunori, Tokyo, JP;
Kenji Nakamura, Tokyo, JP;
Hiroaki Kawashima, Tokyo, JP;
Assignee:
IHI Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/12 (2006.01); F01D 5/02 (2006.01); F01D 5/30 (2006.01); F01D 5/34 (2006.01);
U.S. Cl.
CPC ...
B23K 20/12 (2013.01); F01D 5/025 (2013.01); F01D 5/3061 (2013.01); F01D 5/34 (2013.01); F05D 2230/239 (2013.01);
Abstract
A heating process makes a temperature of joining surfaces Wa and Ta of a pair of metal parts W and T at the start of a first joining process equal to 20% or greater, preferably, 40% or greater of a melting point of material of the metal parts W and T. The heating process makes a heating depth h of the pair of metal parts W and T at the start of the first joining process equal to 1.0 mm or greater.