The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Dec. 26, 2012
Applicant:

Parker-hannifin Corporation, Cleveland, OH (US);

Inventors:

Jason T. Dunn, Minneapolis, MN (US);

Shawn D. Ellis, Golden Valley, MN (US);

Roger W. Briese, Minneapolis, MN (US);

Tad N. Orstad, Elk River, MN (US);

Todd D. Lambert, Brooklyn Park, MN (US);

John E. Page, Greenfield, MN (US);

Mario A. Calvo, Minneapolis, MN (US);

Timothy Skwiot, Winona, MN (US);

Assignee:

Parker-Hannifin Corporation, Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 7/00 (2006.01); H01L 41/113 (2006.01); G01L 9/12 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); G01L 19/04 (2006.01); G01L 19/06 (2006.01); G01L 19/14 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
H01L 41/1132 (2013.01); G01L 7/00 (2013.01); G01L 9/12 (2013.01); G01L 9/0072 (2013.01); G01L 19/0007 (2013.01); G01L 19/0084 (2013.01); G01L 19/04 (2013.01); G01L 19/0645 (2013.01); G01L 19/142 (2013.01); G01L 19/148 (2013.01); H01L 41/0966 (2013.01);
Abstract

A sensor including a buffer material layer configured to at least partially deflect when a force or pressure is imparted on the buffer material layer; and an electroactive polymer (EAP) cartridge in operative contact with the buffer material layer, wherein the EAP cartridge is configured to generate an output signal that corresponds to an amount of strain imparted on the EAP cartridge. The EAP cartridge may be used in a variety of sensing applications including as a pressure sensor integrated into a fluid connector. One aspect of the invention provides for selection of a buffer material layer based upon a desired pressure range.


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