The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Jun. 02, 2011
Hiroyuki Iwaki, Hamamatsu, JP;
Takafumi Ogiwara, Hamamatsu, JP;
Takeshi Sakamoto, Hamamatsu, JP;
Masaharu Hoshikawa, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Daisuke Kawaguchi, Hamamatsu, JP;
Takafumi Tsunematsu, Hamamatsu, JP;
Hiroyuki Iwaki, Hamamatsu, JP;
Takafumi Ogiwara, Hamamatsu, JP;
Takeshi Sakamoto, Hamamatsu, JP;
Masaharu Hoshikawa, Hamamatsu, JP;
Kazuhiro Atsumi, Hamamatsu, JP;
Daisuke Kawaguchi, Hamamatsu, JP;
Takafumi Tsunematsu, Hamamatsu, JP;
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.