The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Jun. 10, 2014
Seagate Technology Llc, Cupertino, CA (US);
Aaron Michael Collins, Minneapolis, MN (US);
Scott Matzke, Shakopee, MN (US);
Christopher Unger, Chanhassen, MN (US);
Paul Davidson, Eden Prairie, MN (US);
Daniel Richard Buettner, Savage, MN (US);
Seagate Technology LLC, Cupertino, CA (US);
Abstract
A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.